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  • 14/08/2018

    From past experience, I have older variant of this case for standard RPi 3, and been using it since bought, and now when upgraded to 3 B+ model, instantly went and bought 2 of these cases. USB component cooling area is well adjusted, processor not so well as it does seem to be very small area. I tested first with thermal paste, not good contact at all with components. Akasa thermal tape (0.3mm) atleast made contact with components, not sure how much pressure there is... I would recommend to use atleast thermal tape / pad, thickness between 0.3mm - 0.5mm, or thermal paste and copper shim combination.

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  • 03/10/2018

    Alright, after my 1st test with Akasa thermal tape (0.3mm), there were small gap left after all, so I recommend to use 0.5mm thermal pads with this case, optimal pressure and contact for good heat transfer. Currently I use Arctic Cooling thermal pads 0.5mm with this case.

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